Asia

Türkiye Cumhuriyeti
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Российская Федерация
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Wafer series with compound spacing

PhotosModelDescriptionSpacingType of bottom platePinState
DS1071-032.75*2.75mm W/ Post & Crimp+Solder Type2.75*2.75mmCrimp2*2~2*20在售
DS10757.5-5.0-5.0mm Wafer & Housing TJC2A Type7.5-5.0-5.0mmV/T1~6在售
DS1075-017.50mm Wafer V/T & R/A Type7.5mmV/T / R/A2~8在售
DS107610.0-8.0-8.0mm Wafer & Housing TJC1 Type10.0-8.0-8.0mmCrimp / V/T1~6在售
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